SupermicroXeon Single Socket S3647, 8x 288-pin DDR4 DIMM slo

Key Features

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Expansion slots:
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
I/O: 1 VGA, 2 COM, TPM header
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector


Stránky o produkte:
https://www.supermicro.com/en/products/motherboard/X11SPi-TF